Fujitsu has demonstrated a mechanical sample of its Armv9-based 144-core Monaka processor for data centers ... on its 3.5D eXtreme Dimension System in Package platform. Satoshi Matsuoka, director ...
If this information is legit, Fab 21 in Arizona is manufacturing at least one Integrated Circuit for Apple's S9 SiP, one of ...
The GLink 2.0 IP using TSMC 5nm Process and 2.5D Advanced Packaging Technology passed ... alternative solutions using ultra-short reach SerDes-based communication through package substrate. For every ...