News

Augmenta, the leading spatial AI design platform for construction, today announced transformative updates to the Augmenta Construction Platform (ACP). The enhanced platform, unveiled ahead of NECA ...
An electromechanical engineering degree that explores the fundamentals of mechatronics, which involves the integration of mechanics, electrical circuits, microprocessors, mathematics, materials ...
Sai Krishna Reddy Mudhiganti, AI researcher and software engineer at Samsung Semiconductor Inc., develops intelligent ...
A workflow that leverages the Ansys Lumerical, Cadence, and GlobalFoundries (GF) Fotonix process design kit for electronic-photonic co-design. November 9th, 2022 - By: Ansys Massive growth in research ...
How to reduce errors and unify MCAD and ECAD teams working together on the same design. How to design with high precision and enable MCAD and ECAD teams to work in their respective design environments ...