The scaling trend toward under 5nm in semiconductor design requires tighter control over defects on wafers. To measure defects on wafer surfaces, several kinds of inspection and review tools can be ...

We introduce a novel tensor contraction processor (TCP) architecture that offers a paradigm shift from traditional architectures that rely on fixed-size matrix multiplications. TCP aims at exploiting ...

Tip-enhanced Raman scattering (TERS) microscopy is an advanced technique for investigation at the nanoscale that provides topographic and chemical information simultaneously. The TERS probe plays a ...

To understand the complexities in building EUV lithography machines, it is important to know the technology. As per IBM Research, EUV light is generated by shooting a high-power laser at droplets of ...

Huawei introduced its new flagship Pura 80 series last week. However, the processor used in the phones did not meet expectations. The series used the 7nm Kirin 9020 chipset, which was previously ...

Typical use cases include surface roughness inspection of bare wafers, 7 post-CMP roughness measurements, 1,2 monitoring of wafer bonding processes, 3,8 and defect inspection and review of hard disk ...

To characterize patterns of charges on electrets, Kelvin probe force microscopy (KFM) usually serves as a very useful tool to measure the electrostatic potential through an electric cycle; however, it ...

Huawei Pura 80 series explained: 1-inch sensors, dual-focal telephoto, big batteries, advanced satellite messaging, and HarmonyOS 5.1 enhancements.

Morphological analysis of polymers on hair fibers by SEM and AFM Valéria Fernandes Monteiro *; Aline Martins Duboc Natal; Luís Edmundo Bastos Soledade; Elson Longo CMDMC, LIEC, UFSCar Rod. Washington ...