The most advanced sub-5nm silicon nodes require the latest EUV (extreme ultraviolet) lithography tools like the one above, but Chinese chipmakers are stuck with DUV (deep ultraviolet) lithography.

While SMIC does have older DUV (Deep Ultraviolet) Lithography machines, the inability of Chinese firms to obtain EUV machines places them 10 to 15 years behind the West according to Fouquet in a ...

The simplest way is to print smaller features. This can be done either by pushing self-aligned double and quadruple patterning (SADP, SAQP) using 193nm ArF lithography or moving to extreme ultraviolet ...

TSMC and Samsung Electronics (Samsung) are set to begin mass production of 2nm technology starting in 2025. Both industry giants are actively vying for customer orders. The South Korean industry ...

TSMC has reportedly set the price of its 2nm wafers at $30,000 per unit, double the cost of its 4nm and 5nm wafers. TSMC Chairman Mark Liu recently remarked, “Customer demand for 2nm technology has ...

As several chipmakers ramp up their 10nm finFET processes, with 7nm just around the corner, R&D has begun for 5nm and beyond. In fact, some are already moving full speed ahead in the arena. Both 5nm ...