At the European Technology Symposium 2024 this week, TSMC said that it would build HBM4 base dies using its 12FFC+ (12nm-class) and N5 (5nm-class ... cost effective base die can reach HBM for ...

US Secretary of Commerce Gina Raimondo announced in a interview that TSMC has begun mass-producing 4nm chips at its Arizona ...

IGAD2DY01A is a high speed die-to-die interface PHY which transmits data through ... IGAD2DY01A is designed and fabricated in TSMC 5nm FF CMOS process with 1.2V analog supply voltage for PLL/PMA and 0 ...

AMD's Navi 48 graphics processing unit, based on the RDNA 4 architecture that the company briefly demonstrated yesterday, is ...

Remarkable physical flexibility allows the PHY to adapt to each customer’s die floorplan and package constraints, yet is delivered and verified as a single unit for easy timing closure with no ...

If this information is legit, Fab 21 in Arizona is manufacturing at least one Integrated Circuit for Apple's S9 SiP, one of ...

When combined with 5nm (32%) and 7nm (17%) contributions, advanced nodes now account for 69% of total wafer revenue. This technology mix is crucial because it showcases TSMC's unmatched ...

TSMC started mass production of cutting edge 7nm process two years ago, and this year, it is mass-producing the 5nm process. Most of TSMC's production capacity has already been pre-ordered by ...

In Q3, 69% of TSMC's revenues came from the sales of 7nm, 5nm, and 3nm chips. The inability to sell 7nm and chips with smaller nodes to the Chinese clients could affect TSMC's performance in the ...

3nm technology will be 30 per cent more energy efficient and 15 per cent faster than the 5nm tech, TSMC says The Taiwan Semiconductor Manufacturing Company (TSMC) expects its advanced 3nm process ...

On Tuesday, Taiwan Semiconductor Manufacturing Company Limited TSM, or TSMC, saw its shares touch a ... with its pre-order demand surpassing that of 3nm and 5nm chips. The 2nm chips feature ...