In the collaboration, AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications ...

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market ... next-generation A14 technology. Advanced 5nm and 3nm on-chip electromagnetic ...

Through continued collaboration with TSMC, Ansys  today announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new ...

This partnership is set to optimize 3D integrated circuit (3D-IC ... Ansys introduced the HFSS-IC Pro electromagnetic solution, certified for TSMC's 5nm and 3nm processes. This certification ...

China’s SMIC has reportedly produced 5nm chips without EUV using DUV and SAQP, signaling a bold shift in chipmaking amid ...

A new technical paper titled “An Investigation of Minimum Supply Voltage of 5nm SRAM from 300K down to 10K” was published by ...

In a move that could reshape the global semiconductor industry, China’s Semiconductor Manufacturing International Corporation (SMIC) has reportedly pulled off 5nm chip production without using ...

To the best of authors’ knowledge, this is the first review to comprehensively explore the application of generative AI models in analog IC circuit design. We conclude that future research could focus ...

HFSS-IC Pro, with RaptorX™ technology embedded, is certified by TSMC for its advanced 5nm and 3nm processes, meeting the rigorous accuracy requirements necessary for designing next-generation ...