TSMC’s 5nm process is already in risk production and offers IC designers a new level of performance and power optimization targeted at the next generation of high-end mobile and HPC applications.

At the European Technology Symposium 2024 this week, TSMC said that it would build HBM4 base dies using its 12FFC+ (12nm-class) and N5 (5nm-class) process technologies, reports AnandTech.

Intel’s 5nm production is targeted for early 2023, sources said, meaning its traditional 2-year process cadence is extending to roughly 2.5 to 3 years. For now, Intel plans to extend the finFET to 7nm ...

which will be made using TSMC’s 5nm process and use InFO-SoW advanced packaging. Musk reportedly told Wei that the future direction of Tesla was… Brian Wang is a Futurist Thought Leader and a popular ...

Hsinchu, Taiwan -- September 26, 2024 – M31 Technology Corporation, a leading global provider of silicon intellectual property (IP), today announced that its cutting-edge ONFi5.1 I/O IP achieved ...