When combined with 5nm (32%) and 7nm (17%) contributions, advanced nodes now account for 69% of total wafer revenue. This technology mix is crucial because it showcases TSMC's unmatched ...

The company already operates a 5nm fab in the same location, so it's not an illogical leap, though TSMC hasn't started producing 5nm chips yet, its website claims that these are "scheduled to ...

TSMC (TSM.US) has not only raised prices in 2024, but has also indicated to many customers in July that the 5nm and 3nm processes will see price hikes, Taiwan media Digitimes quote... In response ...

Fab 18 originally built chips using TSMC’s 5nm process and now also uses the 3nm process for more advanced chips. TSMC also produces 2nm chips at Fab 20 in Baoshan, according to TrendForce.

Hsinchu, Taiwan -- September 26, 2024 – M31 Technology Corporation, a leading global provider of silicon intellectual property (IP), today announced that its cutting-edge ONFi5.1 I/O IP achieved ...

TSMC credited its positive performance during the fourth quarter to robust 3nm and 5nm chip demand. TSMC reported revenue of NT$2.89 trillion in 2024, representing a 33.9% rise compared to 2023.

For the fourth quarter, 3nm contributed 15% of TSMC’s total wafer revenue, up from 6% in the third quarter of 2023. 5nm and 7nm accounted for 35% and 17% respectively in the fourth quarter and the ...

"The demand for artificial intelligence (AI) technologies is quite robust, and hence, there is interest in TSMC's higher-end 3nm and 5nm semiconductor processes," market analysts say. These orders ...

“Our business in the fourth quarter was supported by strong demand for our industry-leading 3nm and 5nm technologies,” Wendell Huang, chief financial officer of TSMC, said in a statement.

TSMC also said then that its 2024 revenue came to NT$2.89 trillion, a 34% gain. "Our business in the fourth quarter was supported by strong demand for our industry-leading 3nm and 5nm technologies ...

IGMTLSY01A is a synchronous LVTLL / LVT / ULVT periphery high-density ternary content addressable memory (TCAM) with column redundancy feature. It is developed with TSMC 5nm 0.75V/1.2V CMOS ...